- and
returning the best
planarization that it finds. In the
simplest form of this process, the
planar embedding of the
planarized subgraph is not allowed...
-
Chemical mechanical polishing (CMP) (also
called chemical mechanical planarization) is a
process of
smoothing surfaces with the
combination of chemical...
- to pattern. CMP (chemical-mechanical
planarization) is the
primary processing method to
achieve such
planarization,
although dry etch back is
still sometimes...
-
Virtual detail of an
integrated circuit through four
layers of
planarized copper interconnect, down to the
polysilicon (pink),
wells (greyish), and substrate...
-
consideration of size effects. a wide
variety of
other processes for cleaning,
planarizing, or
modifying the
chemical properties of
microfabricated devices can...
- In a
tetrahedral molecular geometry, a
central atom is
located at the
center with four
substituents that are
located at the
corners of a tetrahedron. The...
- 1990s,
including chemical-mechanical
polishing or
chemical mechanical planarization (CMP),
trench isolation, and
copper interconnects—although not directly...
- District,
Migdal HaEmek 0.235 1989, 1986 150 1000–350 14,000 Foundry,
Planarized BEOL, W and
Oxide CMP, CMOS, CIS, Power,
Power Discrete Tower Semiconductor...
-
including photolithography, wet etch and clean, chemical-mechanical
planarization, thin-film deposition, bulk
chemical processing,
wafer and
reticle handling...
- in
which an
input graph is
planarized by
replacing crossing points by vertices, a
topological embedding of the
planarized graph is found, edge orientations...
